Semiconductor Engineering - Deep Insights For Chip Engineers
WEBSeptember 16th, 2024 By Karen Heyman. Semiconductor Engineering was created by chip architects, engineers, journalists, end users, industry organizations & standards bodies to provide deep insights into the increasingly complex task of designing, testing, verifying, integrating and manufacturing semiconductors.
Chip Industry Week In Review - Semiconductor Engineering
WEB5 hours ago · October 4th, 2024 - By: The SE Staff. Amkor will provide turnkey advanced packaging and test services to TSMC in Amkor’s planned facility in Peoria, Arizona, in a deal announced on Thursday. The companies jointly specified the packaging technologies, such as TSMC’s Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS).
Partitioning In The Chiplet Era - Semiconductor Engineering
WEB1 day ago · At the heart of any design involving chiplets are partitioning and prioritization. “This is because what is best implemented in 7nm, for example, an I/O, a SerDes, or PCIe PHY is really optimal technology node for that particular function,” Giuliano said. “This can also be referred to as domain-specific disaggregation.
New Transistor Structures At 3nm/2nm - Semiconductor …
WEBJan 25, 2021 · Intel, Samsung, TSMC and others are laying the groundwork for the transition from today’s finFET transistors to new gate-all-around field-effect transistors (GAA FETs) at the 3nm and 2nm nodes, starting either next year or in 2023. GAA FETs hold the promise of better performance, lower power, and lower leakage, and they will be …
Semiconductor Engineering - knowledge-center
WEBA design or verification unit that is pre-packed and available for licensing. Separate electronic devices using Internet or other connections to communicate among the devices. Usually sensors or actuators are sending data to a computing hub. Semiconductor materials enable electronic circuits to be constructed.
Semiconductor Engineering - Technical
WEBSemiconductor Engineering - Technical. AI/ML/DL. Novel NorthPole Architecture Enables Low-Latency, High-Energy-Efficiency LLM inference (IBM Research) Hardware Acceleration Approach for KAN Via Algorithm-Hardware Co-Design. Models for Both Strained and Unstrained GAA FETs Using Neural Networks. Characteristics and Potential HW Architectures for ...
Smart Manufacturing Advances The Next Generation Of …
WEBDec 19, 2023 · Synopsys in the semiconductor supply chain. Synopsys provides such software solutions to semiconductor fabs and the general electronics industry. Offering advanced capabilities in AI and ML, Synopsys recently launched Synopsys.ai, which is a comprehensive solution suite to harness the power of AI from design to ramp and high-volume manufacturing.
News Archives Semiconductor Engineering
WEBSep 25, 2024 · Infineon rolled out the world's first 300mm gallium nitride (GaN) wafer, opening the door for high-volume manufacturing of GaN-based power semiconductors. A 300mm wafer contains 2.3 times as many chips per wafer as a 200mm wafer. Fig.1: Infineon's 300mm GaN wafer. Source: Infineon The Semiconductor Industry Association released its 2024 State ...
Power Semis Usher In The Silicon Carbide Era - Semiconductor …
WEBAug 21, 2023 · Many thousands of power semiconductor modules already are in use in electric vehicles for on-board charging, traction inversion, and DC-to-DC conversion. Today, most of those are fabricated using silicon-based IGBTs. A shift to silicon carbide-based MOSFETs doubles the power density and accelerates switching speed in a smaller and lighter package.
Top Stories Archives Semiconductor Engineering
WEB4 days ago · Experts At The Table: Semiconductor Engineering sat down to discuss what will trigger the creation of a commercial chiplet marketplace, and what those chiplet-based designs will look like, with Elad Alon, CEO of Blue Cheetah; Mark Kuemerle, vice president of technology at Marvell; Kevin Yee, senior director of IP and ecosystem marketing at ...